Total R&D spend & its % for this particular product & services
+7
Focus on Product Innovation
+6
Product Features and Functionality
+13
Variants of products and services as per different applications
+14
Expandability of product and service across different applications
+6
Unique Selling Proposition (USP) of product offered
+8
Product Differentiation and Impact on Customer Value
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UNISEM Presence in
System in Package Technology
Unisem manufactures semiconductor devices as well as provides OSAT services for global electronics companies. The company has a customer base in APAC, North America, and Europe, whereas sales generated from these regions are about 45%, 40%, and 15%, respectively. Moreover, the company has three semiconductor packaging and two wafer bumping facilities centers in China, Malaysia, and Indonesia.
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Enterprise
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