Variants of products and services as per different applications
+14
Expandability of product and service across different applications
+5
Breadth and Depth of Product Offerings
+7
Focus on Product Innovation
+8
Product Differentiation and Impact on Customer Value
+6
Product Features and Functionality
+6
Unique Selling Proposition (USP) of product offered
+5
Total R&D spend & its % for this particular product & services
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AMKOR TECHNOLOGY Presence in
System in Package Technology
The company is mainly engaged in the field of communication technology system, and it has been mainly focusing on expansion across different geographies through new technologies and products in advanced IC packaging. For instance, in December 2016, Amkor Technology completes product qualification for its silicon wafer integrated fan-out technology (SWIFT), the technology used for advanced mobile, networking, and System-in-Package (SiP) applications. Moreover, the company is also focusing on inorganic growth strategies. For instance, in May 2017, Amkor Technology acquired NANIUM (Portugal), a leading provider of fan-out wafer-level (FOWL) semiconductor packaging solutions. Through this acquisition, Amkor Technology strengthens its business position.
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